Engineering Capabilities

Seven Processes.
One Engineering Partner.

Trinity Wen Co., Ltd integrates the complete fabrication chain under a single quality system — eliminating inter-supplier variation and compressing lead times for Semiconductor OEM customers.

01

Laser Cutting

High-precision thermal cutting for complex 2D profiles

Our fibre and CO₂ laser cutting systems deliver clean, burr-free edges on a wide range of metals. Tight nesting algorithms minimise material waste, while automated loading ensures consistent throughput for both prototype and production runs.

Compatible Materials

Mild SteelStainless Steel 304/316Aluminium 5052/6061CopperBrass
Laser Cutting — close-up process detail

Process Specifications

Positional Accuracy±0.05 mm
Max Sheet Size3000 × 1500 mm
Max Thickness (Steel)25 mm
Max Thickness (Aluminium)20 mm
Laser TypesFibre & CO₂
Edge QualityRa ≤ 3.2 μm
02

Bending

CNC press brake forming for complex sheet metal profiles

Our CNC press brakes are programmed with 3D simulation to verify bend sequences before the first part is formed. Offline programming and automatic tool selection reduce setup time and ensure angular repeatability across production batches.

Compatible Materials

Mild SteelStainless SteelAluminiumGalvanised Steel
Bending — close-up process detail

Process Specifications

Angular Accuracy±0.1°
Max Bending Length3000 mm
Max Bending Force220 tonnes
Min Flange Length4 × material thickness
Min Inside Radius0.5 × material thickness
Springback CompensationAutomatic (CNC)
03

Machining

Multi-axis CNC machining for tight-tolerance components

From turned components to complex 5-axis prismatic parts, our machining centre handles the full spectrum of precision work required by semiconductor equipment manufacturers. In-process gauging and CMM verification are standard on all critical dimensions.

Compatible Materials

Aluminium 6061-T6 / 7075Stainless Steel 303/304/316LMild SteelTitaniumCopper / BrassEngineering Plastics (PEEK, Delrin)
Machining — process detail 1
Machining — process detail 2

Process Specifications

Dimensional Tolerance±0.01 mm
Surface FinishRa 0.4 μm
Axes3 / 4 / 5-axis
Max Part Size1000 × 600 × 500 mm
InspectionCMM + 3D Scan
Bore ToleranceH7 / IT6
04

Welding

Certified structural and precision welding for demanding assemblies

Our certified welders operate across TIG, MIG, and spot welding processes. Weld procedures are qualified to international standards, and all structural welds are subject to visual and dimensional inspection. Cleanroom-compatible TIG welding is available for semiconductor-grade assemblies.

Compatible Materials

Stainless Steel 304/316LAluminium 5052/6061Mild SteelGalvanised Steel
Welding — close-up process detail

Process Specifications

ProcessesTIG / MIG / Spot
Welder CertificationAWS / ISO 9606
Min Wall Thickness0.8 mm
Distortion ControlFixture + sequence
InspectionVisual + dimensional
Cleanroom CompatibleYes (TIG)
05

Surface Treatment

Chemical and electrochemical surface finishing for corrosion resistance and cleanliness

Surface treatment is critical in semiconductor environments where contamination and corrosion are unacceptable. We offer a range of chemical and electrochemical processes to meet the cleanliness and corrosion-resistance requirements of OEM specifications.

Compatible Materials

Aluminium (Anodising)Stainless Steel (Passivation / EP)Mild Steel (Zinc / Nickel)Copper (Nickel)
Surface Treatment — close-up process detail

Process Specifications

AnodisingType II / Type III
PassivationASTM A967 / AMS 2700
ElectropolishingRa reduction up to 50%
Chemical ConversionAlodine / Chromate
Zinc PlatingClear / Yellow / Black
Nickel PlatingElectroless / Electrolytic
06

Powder Coating

Durable electrostatic powder coating for functional and cosmetic finishes

Our powder coating line delivers consistent film thickness and adhesion across complex geometries. Pre-treatment includes iron phosphate or zinc phosphate wash to ensure maximum adhesion and corrosion resistance. Custom RAL colours and textures are available.

Compatible Materials

Mild SteelAluminiumGalvanised SteelCast Iron
Powder Coating — close-up process detail

Process Specifications

Film Thickness (DFT)60–80 μm
Colour MatchingRAL / custom
Salt Spray Resistance≥ 500 hours
Pre-treatmentIron / Zinc phosphate
TexturesSmooth / Wrinkle / Matt
Adhesion TestCross-cut ISO 2409
07

Assembly

Sub-assembly and full assembly with functional verification

Trinity Wen Co., Ltd provides complete assembly services — from simple sub-assemblies to complex multi-component systems. Our assembly area is cleanroom-compatible and equipped for functional testing, torque verification, and dimensional inspection prior to shipment.

Compatible Materials

Mixed materials per BOMFastenersSeals / GasketsElectronic sub-components
Assembly — close-up process detail

Process Specifications

EnvironmentCleanroom-compatible
Torque VerificationCalibrated torque tools
Functional TestingPer customer spec
TraceabilityFull lot / serial
PackagingESD / vacuum / custom
DocumentationCoC + inspection report
Trinity Wen

Precision engineering and contract manufacturing for Semiconductor OEM. One-stop fabrication — from raw material to finished assembly.

Contact

Trinity Wen Co., Ltd

บริษัท ทรินิตี้ เหวิน จำกัด

508/23 Soi Phahonyothin 58, Yaek 8
Sai Mai, Bangkok 10220
Thailand (Temporary site)

เลขที่ 508/23 ซอยพหลโยธิน 58 แยก 8
แขวงสายไหม เขตสายไหม กรุงเทพมหานคร 10220
(Temporary site)

REG. NO. 0105569144772

info@trinitywen.com

Mon – Sat: 07:00 – 16:00 (ICT, UTC+7)

© 2026 Trinity Wen Co., Ltd. All rights reserved.

MANUFACTURING EXCELLENCE · ONE-STOP FABRICATION SERVICE